Semiconductor Packaging
Semiconductor Packaging

Fluoplus® FEP film, Fluoplus® PFA film and Fluoplus® ETFE films have excellent chemical resistance and nonstick properties, making them very suitable for release films in composite manufacturing, semiconductor and LED packaging release films, and FPCB hot press release films. This product as a packaging release film can reduce the demolding force  and improve the product yield, and reduce mold pollution during long-term production processes. This product is formed by melt casting extrusion, and the film production process is completed in a dust-free workshop. High glossy or matt film surface is available with a maximum width of 1500mm and a thickness range from 25 μm to 150μm


Product Features

●   High temperature resistance

●   Excellent flexibility, able to match with various surfaces

●   Achieve UL94-V0 level

●   Excellent chemical resistance

●   High cleanliness surface ensures product releasability and durability

●   Excellent mechanical toughness